May 29: The Odisha government has signed an agreement for semiconductor substrate manufacturing in partnership with Intel and 3D Glass Solutions (3DGS), marking a significant step toward strengthening India’s semiconductor ecosystem, Union Minister for Electronics and Information Technology Ashwini Vaishnaw said.
The initiative is aimed at developing advanced semiconductor substrate manufacturing capabilities in the state, positioning Odisha as an emerging hub in India’s growing electronics and chip manufacturing landscape. The collaboration is expected to support high-end semiconductor packaging technologies, which are critical for next-generation computing, artificial intelligence, and advanced electronics applications.
According to officials, the partnership will help build a strong foundation for semiconductor component manufacturing, including advanced substrates used in chip packaging and high-performance computing systems. This is considered a crucial segment of the global semiconductor value chain, where demand is rising rapidly due to growth in AI, cloud infrastructure, and electronics manufacturing.
The agreement is also expected to boost industrial investment in Odisha, generate skilled employment opportunities, and encourage the development of a specialised semiconductor ecosystem in the region. It aligns with India’s broader strategy to reduce dependency on imports and strengthen domestic capabilities in critical technology sectors.
Experts note that collaboration with global technology leaders such as Intel and 3DGS reflects growing international confidence in India’s semiconductor ambitions. It also signals a shift toward establishing India as a key player in advanced chip packaging and substrate technologies, which are essential for modern electronic devices.
Officials further stated that the project will contribute to technology transfer, skill development, and research and development activities in collaboration with industry partners. Over time, this is expected to create a strong supply chain network supporting both domestic and global semiconductor demand.
The development marks a major milestone for Odisha’s industrial growth strategy, as the state continues to attract investments in high-technology manufacturing sectors alongside traditional industries.
With this agreement, India moves a step closer to building a more integrated and self-reliant semiconductor ecosystem, supported by global partnerships and state-level industrial initiatives.
